SuperStick® Low-Melt activates between 185°-200°F
SuperStick® Low-Melt is a proprietary adhesive system developed by DK Group. SuperStick® Low-Melt is a hybrid of thermal and pressure sensitive technologies that offers the best of both worlds. This patent-pending adhesive system is more cost-effective than PSA films and offers superior adhesion compared to thermal adhesives.
Click here to view Xerox's SuperStick® Validation Report
| Market Applications - Book
- Trade Lam
- ID/Card
- Graphics
- POP/Displays
- Packaging
- Signage
- Floor Graphics
Common Substrates
- Paper
- Synthetics
- PVC
- Teslin
- Styrene
- Films
- RC Paper
- Printing/Inks
- Litho/Offset
- Digital-Solvent
| Trouble Lamination - Full-bleed: SuperStick®
- Layered Inks: SuperStick®
- Dark Inks SuperStick®
- Paper Coatings (Ink Reception): SuperStick®
- Oil Residues/Fuser Oil/Toners: SuperStick®
In Development
- SuperStick® PVC
- SuperStick® Tie Layer
- SuperStick® Outdoor
Click on the image below to see how SuperStick works |
