D&K Group - Thermal Adhesive Systems - Homopolymer, Copolymer, Low Melt

Mission History Green Program News Releases Careers

Narrow Format Wide Format School & Desktop Refurbished Equipment

Distributors Warranty Glossary Webbing Diagrams FAQs Calculators Film Rewards Literature Videos Trade Shows Privacy Policy

NARROW FORMAT Diamond Hard Velvet Matte Polyester Films Econo Films Polypropylene Films Nylon Films Specialty Films WIDE FORMAT Diamond Hard Velvet Matte Thermal Films Pressure Sensitive Low-Melt Films SuperStick Printable Media

SuperStick Thermal PS Mounting Adhesives Digital Finishing Solutions

NARROW FORMAT Book Covers Card Apps SuperStick Digital Digital Lamination Solution WIDE FORMAT Flexible Display Rigid Display Floor Graphics Backlit Banners Fleet Graphics FRAMING Canvas System Pouch System Framing Products

Preloaders Cutters Roll Caddy Stackers

SuperStick

Laminating Equipment

Films & Supplies

Adhesive Systems

Applications

Coating Technologies

Accessories

Home » Adhesive Systems » Thermal

Thermal Adhesives

Homopolymer

270° - 310°
Low density polyethylene adhesive.
Very high bond point.
Less clear than copolymer.
School film

Copolymer

220° - 240°
Blend of polymers.
Produces a clear product at much lower temperatures than Econo.
Excellent bond & Clarity
Blocking Issues
Boundary layer
Color shift with Ink Coverage

Low Melt w/UV
(Low-Melt activates between 185 – 200 F)

Market Applications

Framing
Signage
Graphics
Floor Graphics
POP/Displays

Common Substrates

Paper
Synthetics (some)
Teslin
Films
Printing/Inks
Litho/Offset
Digital-Aqueous (some)
Digital-Solvent

© 2012 D&K Group, Inc. All rights reserved.